Process Engineer (Photolithography)

Syenta

📍Tempe, AZ
💰 $110,000 - $150,000
Posted May 19, 2026

Job Overview

Position

Process Engineer (Photolithography)

Company

Syenta

Location

Tempe, AZ

Work Type

On-site

Salary Range

$110,000 - $150,000

Job ID

li-4387694259

Job Description

About Syenta
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.

Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.

About The Role
We are seeking a
Process Engineer (Photolithography)
to join our Tempe team. In this hands-on role, you will develop and manufacture critical components of Syenta’s LEM process, with a strong focus on photolithography and high-resolution patterning.

You will work across microfabrication and characterisation, contributing directly to the development of next-generation stamping processes and helping translate prototypes into scalable manufacturing solutions.

Responsibilities
Process Development & Fabrication

  • Develop and refine process flows for fabrication of LEM stamps

  • Push the boundaries of high-resolution microfabrication and stamping processes

  • Develop tool and material specific recipes for high aspect ratio structures

  • Manufacture prototype components to support mechanical, mechatronic, and software systems

Cross-Functional Collaboration

  • Collaborate closely with Sydney team to develop stamps

  • Work closely with materials scientists, chemists, and engineers to deliver an integrated product

  • Support transfer of developed processes to national and international commercial fabs

  • Ensures clear, timely, and well-documented engagement with external suppliers

Characterisation & Analysis

  • Perform metrology and inspection to assess process quality and reproducibility

  • Analyse experimental data and translate findings into process improvements

Innovation & Continuous Improvement

  • Explore new lithography and fabrication techniques to improve resolution and performance

  • Contribute to continuous improvement of fabrication workflows and process capability

Requirements

  • Bachelor’s degree in Nanotechnology, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or related field

  • Minimum 6 years combined experience in MEMS/microfabrication, academia or industry

  • Experience with DWL, MLA, mask aligner, stepper, and EBL

  • Experience with wet etching processes

  • Experience with photosensitive materials to produce high aspect ratio structures

  • Experience working in semiconductor-grade cleanroom environments

  • Experience in metallisation, lithography, wet etching and thin film deposition

Preferred Qualifications

  • Master of Research or Ph.D. with relevant research or industry experience

  • Experience working within commercial semiconductor fabs or local university fabs

  • Experience with lithography materials (SU-8, AZ resist, dry film resist, etc)

  • Exposure to advanced packaging techniques (wafer bonding, die bonding)

  • Exposure to nano-imprint lithography or hot embossing

  • Knowledge of copper electroplating

Why Choose Syenta?
We’re passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.

What We Offer
Salary Range: US $110k – $150k (negotiable)

  • Early-stage equity opportunities

  • Potential 401(k) and other benefits

  • Comprehensive health, dental, and vision coverage plans, supported by Company

  • Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business

  • Team Events – Annual company event in Australia to collaborate and celebrate

  • Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life

  • 15 days PTO and 10 days sick leave

Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.

Interview Prep

AI-powered insights to help you prepare

Key Skills

Required:
Preferred:

Practice Questions

💡Technical Questions (3)
  • 1.How do you approach developing lithography recipes for high aspect ratio structures using photosensitive materials like SU-8, and what are the most common pitfalls you've encountered?
  • 2.Can you explain your experience transitioning between different lithography tools, such as going from an EBL or MLA for prototyping to a stepper or mask aligner for scalable manufacturing?
  • 3.Walk me through your methodology for troubleshooting a wet etching process that is consistently yielding under-etched or undercut micro-structures on a thin film stack.
🎯Behavioral Questions (3)
  • 1.Tell me about a time you had to collaborate with a cross-functional team—such as materials scientists or mechanical engineers—to translate a prototype process into a scalable manufacturing flow.
  • 2.Describe a situation where you had to push the boundaries of microfabrication to improve resolution or performance, but faced significant technical roadblocks.
  • 3.Give an example of a time you worked with an international or remote team to develop a process. How did you ensure clear, timely, and well-documented engagement?
🧩Situational Questions (2)
  • 1.You are developing a process flow for a new LEM stamp and the metrology data shows inconsistent pattern fidelity across the wafer after a critical lithography step. How do you approach diagnosing and fixing this issue?
  • 2.Imagine you are tasked with transferring a newly developed stamp fabrication process to an external commercial fab, but they report that your recipe is yielding high defectivity on their equipment. How do you handle this?

Resume Keywords

Make sure these keywords appear on your resume

PhotolithographyHigh Aspect RatioMicrofabricationWet EtchingThin Film DepositionSU-8EBLMetrologyProcess TransferCleanroomLEMDOE

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