Process Engineer (Etching)

Syenta

📍Tempe, AZ
💰 $110,000 - $150,000
Posted May 19, 2026

Job Overview

Position

Process Engineer (Etching)

Company

Syenta

Location

Tempe, AZ

Work Type

On-site

Salary Range

$110,000 - $150,000

Job ID

li-4387683823

Job Description

About Syenta
Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.

Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.

About The Role
We are seeking a
Process Engineer (Etching)
to join our Tempe team. In this high-impact role, you will develop, fabricate, and characterise critical components for Syenta’s LEM process. You will work hands-on with microfabrication processes while translating experimental data into actionable improvements.

This role is ideal for someone with proven microfabrication experience, particularly in etching of high aspect ratio structures, who thrives in a collaborative, high-growth startup environment and enjoys seeing their work progress from prototype to fully integrated product.

Responsibilities
Process Development & Fabrication

  • Follow and refine microfabrication process flows for LEM stamps

  • Manufacture prototype LEM stamps to support mechanical, mechatronic, and software systems

  • Develop novel MEMS structures compatible with LEM processes

  • Develop etching processes for high aspect ratio structures on hard oxides

Cross-Functional Collaboration

  • Collaborate closely with Sydney team to develop stamps

  • Work closely with materials scientists, chemists, and engineers to integrate microfabrication into the final product

  • Transfer developed processes to national and international commercial fabs

  • Ensures clear, timely, and well-documented engagement with external suppliers

Characterisation & Quality

  • Conduct metrology and inspection to validate process fidelity, yield, and reproducibility

  • Translate experimental data into actionable process improvements and report results

Innovation & Continuous Improvement

  • Investigate and implement novel etching techniques for high aspect ratio structures

  • Stay abreast of emerging microfabrication technologies and recommend enhancements for LEM processes

Requirements

  • Bachelor’s degree in Nanotechnology, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or related field

  • Minimum 6 years combined experience in MEMS/microfabrication, academia or industry

  • Hands-on experience in metallisation, etching, lithography, thin film deposition, and wafer-to-wafer bonding

  • Experience with ICP and CCP plasma etch tools

  • Experience with TSVs, TGVs, and high aspect ratio etching structures

  • Experience working in semiconductor-grade cleanroom environments

Preferred Qualifications

  • Master of Research or Ph.D. with industry experience

  • Experience working within commercial semiconductor fabs or local university fabs

  • Proficiency with CAD tools (e.g., KLayout) and metrology tools (FIB-SEM, 3D profilometry, optical inspection)

  • Experience with lithography (SU-8, AZ resist, EBL resist), wafer/die bonding, and nano-imprint lithography

  • Knowledge of copper electroplating and advanced packaging techniques

Why Choose Syenta?
We’re passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.

What We Offer
Salary Range: US $110k – $150k (negotiable)

  • Early-stage equity opportunities

  • Potential 401(k) and other benefits

  • Comprehensive health, dental, and vision coverage plans, supported by Company

  • Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business

  • Team Events – Annual company event in Australia to collaborate and celebrate

  • Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life

  • 15 days PTO and 10 days sick leave

Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.

Interview Prep

AI-powered insights to help you prepare

Key Skills

Required:
Preferred:

Practice Questions

💡Technical Questions (3)
  • 1.Can you describe your approach to developing an etching process for high aspect ratio structures on hard oxides, and how you would optimize it for LEM stamp fabrication?
  • 2.How do you utilize metrology tools like FIB-SEM and 3D profilometry to validate the fidelity and yield of microfabricated MEMS structures, and how do you feed that data back into process improvements?
  • 3.What are the primary challenges you have encountered when transferring a microfabrication process from a prototype or university fab to a commercial semiconductor fab?
🎯Behavioral Questions (3)
  • 1.Tell me about a time you had to collaborate with a cross-functional team—such as materials scientists, chemists, or mechanical engineers—to integrate a microfabrication process into a final product.
  • 2.Describe a situation where an etching process you developed was not producing the required high aspect ratio structures. How did you troubleshoot and improve it?
  • 3.Give an example of a time you had to manage a process development project with tight deadlines in a startup or high-growth environment. How did you ensure timely delivery?
🧩Situational Questions (2)
  • 1.You are developing a novel MEMS structure for an LEM stamp, and the etch rate is inconsistent across the wafer, causing yield issues. What steps do you take to identify the root cause and resolve it?
  • 2.You need to transfer a newly developed etching process to an international commercial fab, but their tool set differs slightly from your R&D setup. How do you ensure a successful technology transfer?

Resume Keywords

Make sure these keywords appear on your resume

ICP EtchingCCP EtchingHigh Aspect RatioTSV/TGVMicrofabricationMEMSMetrologyFIB-SEMKLayoutProcess TransferLithographyCleanroom

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