Photolithography Process Engineer

NXP Semiconductors

📍Chandler, AZ
Posted May 22, 2026

Job Overview

Position

Photolithography Process Engineer

Company

NXP Semiconductors

Location

Chandler, AZ

Work Type

On-site

Job ID

li-4418198848

Job Description

Business Line Description
NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our customers.

Job Summary
Photolithography Process Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous experience with ASML Scanner, Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM or Archers is highly desirable.

Key Challenges

  • Reducing overall cost of non-conformal like wafer scrap, and photo rework

  • Developing and writing standard work procedure document for Out of Control Action Plan

  • Implementation of process SPC using Six-Sigma statistical methodology

  • Process development and optimization utilizing Six-Sigma methodology

  • Improving tool utilization and availability

  • Working with manufacturing and industrial engineering for capacity planning and modeling

  • Participating in and/or leading cross-functional and lean activity teams

  • Supporting process development activities

  • Sourcing and process releasing new equipment

  • Training process technician in dispositioning of wafer in process out of control situations

  • Training wafer FAB associate in process tool operation using our standard work process

Cross Functional Aspects

  • Working closely with Photo equipment team to identify and reduce source of process variation and implementing zero defect process

  • Collaborate with device team to improve process integration margin

Job Qualifications

  • Must have a BS or MS degree in engineering or a degree in relevant field of studies

  • More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment is preferred

  • Six-Sigma statistical methodology

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

Interview Prep

AI-powered insights to help you prepare

Key Skills

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Preferred:

Practice Questions

💡Technical Questions (3)
  • 1.Can you explain your approach to identifying and reducing sources of process variation on photolithography equipment like ASML scanners or TEL tracks?
  • 2.How do you go about developing and writing an Out of Control Action Plan (OCAP) for a photolithography process, and how do you ensure it is effectively utilized by the shift technicians?
  • 3.Walk me through your experience with process release and qualification of new lithography equipment or materials in a high-volume fab.
🎯Behavioral Questions (3)
  • 1.Tell me about a time you successfully reduced wafer scrap or photo rework in a high-volume manufacturing environment.
  • 2.Describe a situation where you had to train wafer fab associates or technicians on a new standard work procedure or tool operation.
  • 3.Give me an example of a time you collaborated with a device or integration team to improve process integration margins.
🧩Situational Questions (2)
  • 1.You are notified by manufacturing that the KLA 8100 CDSEM is showing a sudden, significant shift in critical dimensions, and the SPC chart has triggered an out-of-control alarm. What are your immediate steps?
  • 2.You are tasked with improving the utilization and availability of a TEL track, but you cannot simply reduce the necessary process times. How would you approach this challenge?

Resume Keywords

Make sure these keywords appear on your resume

PhotolithographyASML ScannerTEL TrackKLA CDSEMSix-SigmaSPCOCAPSemiconductor ManufacturingProcess IntegrationYield ImprovementRework ReductionLean Manufacturing

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