PCBA Failure Analysis Engineer

AMD

📍Austin, TX
Posted May 22, 2026

Job Overview

Position

PCBA Failure Analysis Engineer

Company

AMD

Location

Austin, TX

Work Type

On-site

Job ID

li-4352762172

Job Description

WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.
Together, we advance your career.
The Role
As a PCBA Failure Analysis Engineer, you will play a critical role in diagnosing, isolating, and resolving complex board and system-level issues. This is a highly technical, hands-on position where you will work with advanced tools and methodologies to uncover root causes of failures and provide valuable feedback to improve AMD’s product design, reliability, and manufacturing processes. You will collaborate closely with design, manufacturing, and quality teams to ensure continuous improvement and robust product performance.

The Person
The ideal candidate is detail-oriented, analytical, and thrives in a lab-based environment. Success in this role requires strong problem-solving skills, effective communication, and the ability to translate technical findings into actionable recommendations. You should be comfortable working independently as well as cross-functionally, driving both technical investigations and process improvements.

Key Responsibilities

  • Conduct laboratory analysis of PCBAs to diagnose and isolate failure modes through visual inspection and electrical test equipment such as oscilloscopes and DMMs.

  • Investigate and identify root causes of system and board failures, utilizing both destructive and non-destructive testing methods.

  • Develop and implement advanced failure analysis methodologies using tools such as X-ray, cross-sectioning, SEM (Scanning Electron Microscope), or FIB (Focused Ion Beam) for deeper analysis.

  • Create formal, concise failure analysis reports detailing findings, data, root causes, and recommended next steps for internal and external stakeholders.

  • Communicate progress, status, and technical issues effectively to management and cross-functional teams.

  • Partner with design, manufacturing, and quality assurance teams to drive corrective actions and process improvements.

  • Provide recommendations for Design for Manufacturability (DFM) and Design for Testability (DFT) to enhance product reliability and manufacturability.

Preferred Experience

  • Hands-on experience in failure analysis of PCBAs, boards, or systems.

  • Experience troubleshooting PCBA board-level issues such as power, temperature, and performance.

  • Experience with electrical test equipment such as oscilloscopes and DMMs.

  • Familiarity with destructive and non-destructive analysis techniques including X-ray, cross-sectioning, SEM, and FIB.

  • Strong technical report writing and communication skills.

  • Experience collaborating with cross-functional engineering and manufacturing teams to drive corrective actions.

  • Knowledge of DFM and DFT principles.

  • Willingness to travel up to 25%.

Academic Credentials

  • Bachelor’s Degree in Electrical Engineering required, and a Master’s Degree in Electrical Engineering preferred

LOCATION:
Austin, Texas

This role is not eligible for Visa sponsorship
*Benefits offered are described:*
AMD benefits at a glance.

*AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.*
*AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.*
*This posting is for an existing vacancy.*

Interview Prep

AI-powered insights to help you prepare

Key Skills

Required:
Preferred:

Practice Questions

💡Technical Questions (3)
  • 1.Walk me through your process for diagnosing a PCBA that fails during system-level power-on testing, specifically when you suspect a power delivery issue.
  • 2.When would you choose to use a non-destructive method like X-ray versus a destructive method like cross-sectioning or FIB during a failure analysis investigation?
  • 3.How do you incorporate DFM and DFT principles into your failure analysis reports to improve future product iterations?
🎯Behavioral Questions (3)
  • 1.Tell me about a time you uncovered a complex root cause on a PCBA that others had missed. How did you isolate it, and what was the outcome?
  • 2.Describe a situation where you had to communicate a highly technical failure analysis finding to a non-technical stakeholder or management. How did you ensure they understood the implications?
  • 3.Give an example of a time you worked with design, manufacturing, or quality teams to drive a corrective action based on your failure analysis. How did you handle any resistance?
🧩Situational Questions (2)
  • 1.You receive a batch of returned boards from the field with intermittent thermal throttling issues, but they pass all standard electrical tests in the lab at room temperature. How do you approach isolating this failure?
  • 2.You are analyzing a critical failure, but the design team insists the issue is a manufacturing defect, while the manufacturing team insists it's a design flaw. Both sides are waiting on your analysis to proceed. How do you handle this pressure and ensure an objective conclusion?

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